Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management
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United States of America Patent
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Sep 20, 2005
Grant Date -
Nov 21, 2002
app pub date -
May 16, 2002
filing date -
Jul 15, 1999
priority date (Note) -
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Abstract
A microprocessor packaging architecture using a modular circuit board assembly that provides power to a microprocessor while also providing for integrated thermal and electromagnetic interference (EMI) is disclosed. The modular circuit board assembly comprises a substrate, having a component mounted thereon, a circuit board, including a circuit for supplying power to the component, and at least one conductive interconnect device disposed between the substrate and the circuit board, the conductive interconnect device configured to electrically couple the circuit to the component.
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