High temperature stable adhesive
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United States of America Patent
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Sep 27, 2005
Grant Date -
Aug 21, 2003
app pub date -
Mar 7, 2002
filing date -
Feb 18, 2002
priority date (Note) -
Expired
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Abstract
In order to provide a high temperature resistant adhesive based on water glass which is particularly suited for sticking metal substrates and which remains gas-tight and does not lose its electrical insulating properties even at high operational temperatures, it is proposed that the adhesive should comprise an additive in the form of boron nitride.
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