Encapsulation for organic light emitting diodes devices
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United States of America Patent
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Sep 27, 2005
Grant Date -
Nov 6, 2003
app pub date -
May 2, 2002
filing date -
May 2, 2002
priority date (Note) -
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Abstract
An embodiment of an encapsulated OLED device is described. This embodiment of the encapsulated OLED device is formed by: fabricating multiple OLED devices on a substrate; depositing at least one planarization layer on the OLED devices; hardening the at least one planarization layer in a patterned manner such that the hardened region substantially covers the OLED device; removing areas of the at least one planarization layer that are not hardened; and selectively depositing at least one barrier layer over the hardened region.
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