Polymer compound, precursor for the same and thin film-forming method using the same polymer precursor

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United States of America Patent

PATENT NO 6949618
APP PUB NO 20030153719A1
SERIAL NO

10283481

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Abstract

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Provided are polyimide and a thin film thereof which have a three-dimensional structure and therefore are excellent in a mechanical strength and a heat resistance as compared with those of conventional linear polyimide. The polyimide is obtained from a salt of multifunctional amine represented by Formula (1): ##STR1##

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Patent Owner(s)

Patent OwnerAddress
CHISSO CORPORATIONOSAKA-SHI OSAKA 530-0055

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kato, Takashi Yokohama, JP 514 6728

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