Production method for flexible printed board
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United States of America Patent
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Oct 4, 2005
Grant Date -
Apr 15, 2004
app pub date -
Aug 12, 2003
filing date -
Aug 13, 2002
priority date (Note) -
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Abstract
A flexible printed board production method which ensures higher adhesion of copper, excellent workability, easier continuous production and lower costs. The flexible printed board production method comprises the steps of: treating a surface of a polyimide resin film with plasma or short wavelength ultraviolet radiation; activating the treated surface with the use of an alkali metal hydroxide; electrolessly plating the surface of the polyimide resin film with nickel; and electroplating the electrolessly plated surface of the polyimide resin film with copper, whereby a copper layer is formed on the surface of the polyimide resin film.
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