Method for stripping sacrificial layer in MEMS assembly
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United States of America Patent
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Oct 4, 2005
Grant Date -
Dec 9, 2004
app pub date -
Jun 4, 2003
filing date -
Jun 4, 2003
priority date (Note) -
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status (Latency Note)
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Abstract
The present invention provides methods of manufacturing a MEMS assembly. In one embodiment, the method includes mounting a MEMS device, such as a MEMS mirror array, on an assembly substrate, where the MEMS device has a sacrificial layer over components formed therein. The method also includes coupling an assembly lid to the assembly substrate and over the MEMS device to create an interior of the MEMS assembly housing the MEMS device, whereby the coupling maintains an opening to the interior of the MEMS assembly. Furthermore, the method includes removing the sacrificial layer through the opening. A MEMS assembly constructed according to a process of the present invention is also disclosed.
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