Method relating to anodic bonding
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United States of America Patent
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-
Oct 4, 2005
Grant Date -
N/A
app pub date -
Oct 17, 2000
filing date -
Oct 19, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The present invention relates to a method of bonding a first member (110, 210, 130, 230, 410, 430, 510, 530, 610) to a second silicon member (120, 220, 420a, 420b, 600) through anodic bonding. The method comprises the steps of selectively depositing on said first member bondable sections (170a, 170b, 270, 470a, 470b, 470c, 570, 620) before bringing said first and second members together for anodic bonding.
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