Microelectromechanical device with integrated conductive shield

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United States of America Patent

PATENT NO 6952042
APP PUB NO 20030230147A1
SERIAL NO

10172865

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A microelectromechanical device and method of fabricating the same, including a layer of patterned and deposited metal or mechanical-quality, doped polysilicon inserted between the appropriate device element layers, which provides a conductive layer to prevent the microelectromechanical device's output from drifting. The conductive layer may encapsulate of the device's sensing or active elements, or may selectively cover only certain of the device's elements. Further, coupling the metal or mechanical-quality, doped polysilicon to the same voltage source as the device's substrate contact may place the conductive layer at the voltage of the substrate, which may function as a Faraday shield, attracting undesired, migrating ions from interfering with the output of the device.

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Patent Owner(s)

Patent OwnerAddress
HONEYWELL INTERNATIONAL INC855 S MINT STREET CHARLOTTE NC 28202

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Gardner, Gary R Golden Valley, MN 5 115
Rahn, Curtis H Plymouth, MN 9 108
Stratton, Thomas G Roseville, MN 17 385

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