Capsulated abrasive composition and polishing pad using the same

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United States of America Patent

PATENT NO 6953489
APP PUB NO 20030139127A1
SERIAL NO

10331252

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Abstract

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Capsulated abrasive compositions and a polishing pad using the same. More specifically, a polishing pad coated with compositions, which contain a capsulated abrasive, thereby used for planarizing interlayer insulating film formed on a semiconductor substrate by chemical mechanical polishing.

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Patent Owner(s)

Patent OwnerAddress
HYNIX SEMICONDUCTOR INCGYEONGGI DO SOUTH KOREA GYEONGGI-DO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Choi, Yong Soo Sungnam-shi, KR 28 191
Park, Hyung Soon Ichon-shi, KR 26 125

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