Circuit board for connecting an integrated circuit to a support and IC BGA package using same
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United States of America Patent
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Oct 11, 2005
Grant Date -
Oct 6, 2005
app pub date -
Mar 31, 2004
filing date -
Mar 31, 2004
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An apparatus for connecting an integrated circuit to a support has a circuit board having a first surface for attaching the integrated circuit and a second surface opposite to the first surface. Recesses are provided in the second surface for receiving at least portions of solder balls for electrically and mechanically connecting the circuit board to the support. Solder pads are formed within the recesses. An IC BGA package making use of such an integrated circuit can be implemented with a reduced height and improved electrical characteristics when compared to existing designs.
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