US Patent No: 6,954,585

Number of patents in Portfolio can not be more than 2000

Substrate processing method and apparatus

Stats

ALSO PUBLISHED AS: 20040110106
ATTORNEY / AGENT: (SPONSORED)
 

Importance

Loading Importance Indicators... loading....

Abstract

A method for heating a wafer to a predetermined temperature, the wafer being held by a holding unit and being accommodated in a processing container equipped with a heater. The wafer is heated to a processing temperature while positioning the wafer at an adjacent position that results form making the wafer approach the heating surface of the heater. After heating the wafer to the predetermined temperature, the wafer is separated from the flat bottom surface of the container body to a processing position. In this state, a processing chamber of the processing container is supplied with a processing fluid, while the holding unit and the heater are relatively moved close to and apart from each other intermittently or continuously. Accordingly, it is possible to quickly heat the substrate to a processing temperature while supplying the substrate with the processing fluid uniformly. This improves throughout and the homogenization in processing.

Loading the Abstract Image... loading....

First Claim

Related Publications

Loading Related Publications... loading....

Patent Owner(s)

Patent OwnerAddressTotal Patents
TOKYO ELECTRON LIMITEDTOKYO5116

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Mokuo, Shori Saga-ken, JP 15 168

Cited Art

Patent Info (Count) # Cites Year
 
TOKYO ELECTRON LIMITED (1)
6,140,256 Method and device for treating semiconductor with treating gas while substrate is heated 10 1998

Patent Citation Ranking

Forward Cites

Patent Info (Count) # Cites Year
 
ADVANCED DISPLAY PROCESS ENGINEERING CO., LTD. (4)
8,349,082 Vacuum processing apparatus 0 2009
8,187,384 Vacuum processing apparatus 1 2009
8,152,926 Vacuum processing apparatus 1 2009
8,075,691 Vacuum processing apparatus 3 2009
 
APPLIED MATERIALS, INC. (1)
7,628,863 Heated gas box for PECVD applications 1 2004
 
AXCELIS TECHNOLOGIES, INC. (1)
7,485,190 Apparatus for heating a substrate in a variable temperature process using a fixed temperature chuck 0 2005
 
SEMES CO., LTD. (1)
8,256,774 Chucking member and spin head and method for chucking substrate using the chucking member 0 2007

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
7.5 Year Payment $3600.00 $1800.00 $900.00 Apr 11, 2013
11.5 Year Payment $7400.00 $3700.00 $1850.00 Apr 11, 2017
Fee Large entity fee small entity fee micro entity fee
Surcharge - 7.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00