Encapsulants for protecting MEMS devices during post-packaging release etch
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United States of America Patent
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Oct 18, 2005
Grant Date -
N/A
app pub date -
Jun 26, 2003
filing date -
May 16, 2000
priority date (Note) -
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Abstract
The present invention relates to methods to protect a MEMS or microsensor device through one or more release or activation steps in a 'package first, release later' manufacturing scheme: This method of fabrication permits wirebonds, other interconnects, packaging materials, lines, bond pads, and other structures on the die to be protected from physical, chemical, or electrical damage during the release etch(es) or other packaging steps. Metallic structures (e.g., gold, aluminum, copper) on the device are also protected from galvanic attack because they are protected from contact with HF or HCL-bearing solutions.
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