Compliant interconnect assembly
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United States of America Patent
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Oct 25, 2005
Grant Date -
Feb 12, 2004
app pub date -
Jun 3, 2003
filing date -
Jan 20, 2000
priority date (Note) -
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status (Latency Note)
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Abstract
An apparatus and method for making a compliant interconnect assembly. The compliant interconnect assembly includes a first carrier having a first major surface and a plurality of through openings. A first major surface of a first flexible circuit member having a plurality of electrical traces is attached to the first major surface of the first carrier. The electrical traces include a plurality of compliant members having at least one distal end projecting in one of the openings of the first carrier. A first major surface of a second carrier is positioned opposite a second major surface of the first flexible circuit member. The second carrier has a plurality of through openings aligned with the plurality of the compliant members.
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