Material separation to form segmented product
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United States of America Patent
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Oct 25, 2005
Issued Date -
N/A
app pub date -
Apr 9, 2003
filing date -
Apr 9, 2003
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A method of removing selected portions of material from a base material using a plurality of different depth cuts (e.g., using laser cutting) such that apertured sections (or segments) are expeditiously removed for eventual use with another component or otherwise. In one example, the segmented section so removed can be used to bond various elements of an electronic package which in turn can then be positioned and used within an information handling system such as a computer, server, mainframe, etc.
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