Electromechanical module, for holding IC-chips in a chip testing system, that synchronizes and translates test signals to the IC-chips
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United States of America Patent
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Oct 25, 2005
Grant Date -
N/A
app pub date -
Jan 16, 2004
filing date -
Jan 16, 2004
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An electromechanical module, for holding IC-chips in a chip testing system, includes a circuit board having a plurality of sockets mounted thereon. Each socket is structured to hold one IC-chip that is to be tested, and each socket has a corresponding register on the circuit board. In addition, a bus is on the circuit board, which—a) sends a timing pulse to a clock input on all of the registers in parallel, and b) concurrently sends a clock signal and N-1 test signals to N data inputs on all of the registers. Further, each socket has N input terminals that are connected to N outputs on a respective set of signal translators on the circuit board, and each set of signal translators has N inputs that are connected to N data outputs on the socket's corresponding register.
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