Cooling apparatus for electronic apparatus
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 25, 2005
Grant Date -
May 19, 2005
app pub date -
Nov 18, 2003
filing date -
Nov 18, 2003
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An electronic component that generates heat is enclosed in a body. A bottom panel forms a part of the body. A heat receiving portion is thermally connected to the electronic component. A heat radiating portion that radiates the heat received by the heat receiving portion forms a part of the bottom panel. A liquid cooling path, inside which liquid coolant is circulated, is thermally coupled to the heat receiving portion and the heat radiating portion.
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