Structure comprising a binder layer non-delaminable with respect to a metallized substrate and peelable with respect to a polypropylene substrate
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United States of America Patent
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Nov 1, 2005
Grant Date -
Mar 21, 2002
app pub date -
Mar 30, 2001
filing date -
Mar 30, 2000
priority date (Note) -
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status (Latency Note)
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Abstract
A multilayer structure of, in succession, a metal layer or a metallized-substrate layer, a layer of a polypropylene-based binder extrusion-coated at a rate of more than 100 m/min. and optionally a polypropylene layer, the metal or metallized layer and the binder layer being made non-delaminable by heat treating the structure. The extrudable binder contains by weight: (A) 5 to 30% of a copolymer of ethylene and one or more comonomers chosen from the group of carboxylic acid esters, vinyl esters and dienes in particular the ethylene/alkyl (meth)acrylate/maleic anhydride terpolymer; (B) 40 to 93% of a stretchable polypropylene; and (C) 2 to 30% of a polypropylene functionalized by an unsaturated carboxylic acid anhydride, especially maleic anhydride; the MFI of the composition being between 10 and 50 g/10 min. (at 230.degree. C./2.16 kg). the multi-layer structure is useful for the production of packages.
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