Method of manufacturing multilayer microwave couplers using vertically-connected transmission line structures
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United States of America Patent
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Nov 8, 2005
Grant Date -
May 24, 2001
app pub date -
Jan 23, 2001
filing date -
Jun 11, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A microwave coupler is constructed in a multilayer, vertically-connected stripline architecture provided in the form of a microwave integrated circuit that has a homogeneous, multilayer structure. Such a coupler has a vertically-connected stripline structure in which multiple sets of stripline layers are separated by interstitial groundplanes, and wherein more than one set of layers has a segment of coupled stripline. A typical implementation operates at frequencies from approximately 0.5 to 6 GHz, although other frequencies are achievable.
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