IC module, and wireless information-storage medium and wireless information-transmitting/receiving apparatus including the IC wireless

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United States of America Patent

PATENT NO 6963028
SERIAL NO

11097136

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An IC module includes a lead frame having terminals that are to be connected to an antenna coil of an IC card, and an IC chip and multilayer chip capacitors for tuning mounted on the lead frame and encapsulated by a resin. The multilayer chip capacitors are mounted in grooves on the lead frame.

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Patent Owner(s)

  • SONY CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Abe, Shigenobu Miyagi, JP 8 203
Takubo, Hiroyuki Kanagawa, JP 6 55
Tanaka, Junichi Kanagawa, JP 324 3455

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