Vertically mountable and alignable semiconductor device assembly
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United States of America Patent
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-
Nov 8, 2005
Grant Date -
Jun 19, 2003
app pub date -
Jan 27, 2003
filing date -
Dec 31, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A vertically mountable semiconductor device including a plurality of stub contacts extending perpendicularly from a bottom edge thereof. A complementary alignment device includes a receptacle for receiving the vertically mountable semiconductor device. The alignment device is attachable to a carrier substrate. Upon attachment of the alignment device to a carrier substrate and insertion of a vertically mountable semiconductor device into the receptacle, a contact element applies a downward force to the vertically mountable semiconductor device to establish and maintain an electrical connection between the vertically mountable semiconductor device and the carrier substrate.
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