Semiconductor integrated circuit device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Nov 8, 2005
Grant Date -
Jan 15, 2004
app pub date -
Dec 17, 2001
filing date -
Dec 18, 2000
priority date (Note) -
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Abstract
Circuit elements and wirings constituting a circuit, and first electrodes electrically connected to such a circuit are provided on one main surface of a semiconductor substrate. An organic insulating film is formed on the circuit except for openings on the surfaces of the first electrodes. First and second external connecting electrodes are provided on the organic insulating film. At least one conductive layer for electrically connecting the first and second external connecting electrodes and the first electrodes is placed on the organic insulating film.
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