Thermal-sprayed metallic conformal coatings used as heat spreaders
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United States of America Patent
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Nov 15, 2005
Grant Date -
Apr 10, 2003
app pub date -
Nov 1, 2002
filing date -
May 10, 2001
priority date (Note) -
In Force
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Abstract
Heat dissipation and electromagnetic interference (EMI) shielding for an electronic device having an enclosure. An interior surface of the enclosure is covered with a conformal metallic layer which, as disposed in thermal adjacency with one or more heat-generating electronic components or other sources contained within the enclosure, may provide both thermal dissipation and EMI shielding for the device. The layer may be sprayed onto the interior surface in a molten state and solidified to form a self-adherent coating.
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