Reinforced lead-frame assembly for interconnecting circuits within a circuit module
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 15, 2005
Issued Date -
N/A
app pub date -
Feb 3, 2003
filing date -
Sep 19, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A lead-frame method and assembly for interconnecting circuits within a circuit module allows a circuit module to be fabricated without a circuit board substrate. Integrated circuit dies are attached to a metal lead-frame assembly and the die interconnects are wire-bonded to interconnect points on the lead-frame assembly. An extension of the lead-frame assembly out of the circuit interconnect plane provides external electrical contacts for connection of the circuit module to a socket.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully