Bi-level heat sink
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United States of America Patent
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-
Nov 22, 2005
Issued Date -
N/A
app pub date -
Oct 25, 2002
filing date -
Jan 3, 2002
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A bi-level assembly comprises a heat sink, a processor and a power supply. The heat sink includes a base and at least one fin structure attached to the base. The base may be a plate with attached heat pipes or the base may be a vapor chamber. The base is connected to the top of the processor and power supply and has an s-bend to accommodate the differing heights of the processor and power supply. Heat from the higher heat generating processor may be transferred by the base and dissipated by the fins above the power supply.
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