Device for fixing thin and flexible substrates
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United States of America Patent
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Nov 22, 2005
Grant Date -
Jun 3, 2004
app pub date -
Jul 31, 2003
filing date -
Aug 2, 2002
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A device or chuck for fixing thin and/or flexible substrates allows a uniform and all-over sucking-up of the substrates without any disadvantageous warping or bending. The chuck has notches and holes communicating with a plurality of microgrooves arranged on the bearing surface. If a vacuum device sucks off air through the bores and the notches, a vacuum extends in the microgrooves so that a substrate located on the bearing surface is sucked up.
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