Wafer-interposer assembly
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Nov 22, 2005
Grant Date -
Aug 12, 2004
app pub date -
Feb 5, 2004
filing date -
Jul 31, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A wafer-interposer assembly (10) includes a semiconductor wafer (12) having a plurality of semiconductor die (14) that have a plurality of first electrical contact pads (16). An interposer (22) is connected to the semiconductor wafer (12) such that a plurality of second electrical contact pads (26) associated with the interposer (22) are respectively connected to at least some of the first electrical contact pads (16) via conductive attachment elements (20). A communication interface (28) is integrally associated with the interposer (22) and electrically connected to at least some of the plurality of second electrical contact pads (26). The interposer (22) and the semiconductor wafer (12) are operable to be singulated into a plurality of chip assemblies.
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