Microencapsulated electrophoretic display with integrated driver
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United States of America Patent
Stats
-
Nov 22, 2005
Grant Date -
Jan 30, 2003
app pub date -
Jul 27, 2001
filing date -
Jul 27, 2001
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A mounted display assembly comprises a flexible substrate that supports both display elements and control circuits. The display assembly generally comprises: an electrical connection formed on the flexible substrate, the electrical connection having first and second contact pads; a display element in electrical communication with the first contact pad; and a control circuit mounted on the flexible substrate and in electrical communication with the second contact pad. In a preferred embodiment, the display element comprises a microencapsulated electrophoretic display medium. In another preferred embodiment, printing processes are employed in manufacturing methods for the display assembly.
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