Adhesive and encapsulating material with fluxing properties
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United States of America Patent
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Dec 6, 2005
Grant Date -
N/A
app pub date -
Apr 22, 1999
filing date -
Apr 22, 1998
priority date (Note) -
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Abstract
The attachment of an electrical component to an electrical termination on a component-carrying substrate by a solder bump technique of a thermally curable adhesive composition for encapsulating purposes is described which comprises a thermosetting polymer and a chemical cross-linking agent which has fluxing properties but which is unreactive or of severely restricted reactivity with the polymer without the action of heat and/or catalyst. The composition is to be thermally curable when heated to soldering temperatures in a reaction which is catalyzable merely by metal oxide fluxed from metal surfaces by cross-linking agent then dissolved in the thermosetting polymer.
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