Polishing silicon wafers
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United States of America Patent
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Dec 6, 2005
Issued Date -
N/A
app pub date -
Oct 22, 2003
filing date -
Jul 30, 1997
priority date (Note) -
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status (Latency Note)
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Abstract
An endless belt for a belt type polishing machine comprises a support fabric and a polymer layer of relatively low hardness. The polymer layer is formed with drainage grooves. The support fabric may comprise a non woven or woven material, or a membrane with oriented reinforcing yarns. A further version comprises a spiral-link fabric supporting a woven or non woven layer carrying the polymer layer. The polymer layer may be a double layer, the upper of which is either harder or softer than the lower layer.
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