Semiconductor device and method of manufacture thereof, circuit board and electronic instrument
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United States of America Patent
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Dec 6, 2005
Grant Date -
Dec 12, 2002
app pub date -
Jul 9, 2002
filing date -
Jul 1, 1998
priority date (Note) -
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Abstract
A semiconductor device and a method of manufacturing the semiconductor device includes: a first step of interposing a thermosetting anisotropic conductive material 16 between a substrate 12 and a semiconductor chip 20; a second step in which pressure and heat are applied between the semiconductor chip 20 and the substrate 12, an interconnect pattern 10 and electrodes 22 are electrically connected, and the anisotropic conductive material 16 is spreading out beyond the semiconductor chip 20 and is cured in the region of contact with the semiconductor chip 20; and a third step in which the region of the anisotropic conductive material 16 other than the region of contact with the semiconductor chip 20 is heated.
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