Semiconductor multi-package module including stacked-die package and having wire bond interconnect between stacked packages
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United States of America Patent
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Dec 6, 2005
Grant Date -
Mar 25, 2004
app pub date -
Aug 2, 2003
filing date -
Sep 17, 2002
priority date (Note) -
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Abstract
A semiconductor multi-package module having stacked first and second packages, each package including a die attached to a substrate, in which the first and second substrates are interconnected by wire bonding, and wherein at least one said package comprises a stacked die package. Also, a method for making a semiconductor multi-package module, by providing a stacked die molded first package including a first package substrate, affixing a second molded package including a second substrate onto an upper surface of the first package, and forming z-interconnects between the first and second substrates.
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