Compliant package with conductive elastomeric posts
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United States of America Patent
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Dec 6, 2005
Grant Date -
Sep 2, 2004
app pub date -
Aug 19, 2003
filing date -
Dec 12, 1996
priority date (Note) -
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status (Latency Note)
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Abstract
An assembly including a first microelectronic element having a first surface and a plurality of contacts exposed at the first surface; a second microelectronic element having a top surface and a plurality of contacts exposed at the top surface; and conductive elastomeric posts formed by curing a conductive elastomeric material, wherein each of the contacts of the first microelectronic element is respectively aligned with one of the contacts of the second microelectronic element, and further wherein at least some of the contacts of the first element are connected to the respectively aligned contacts of the second element by the conductive elastomeric material.
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