Communication module and communication apparatus having such a communication module

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6973327
APP PUB NO 20020183094A1
SERIAL NO

10131327

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An IC chip with IC card functions, a contactless IC card antenna, and an antenna connection circuit for connecting the IC chip and the contactless IC card antenna are provided on a mount board, and are combined to form a communication module, thereby making the communication module smaller. The communication module can be mounted on and removed from a mobile phone, thereby making it possible to downsize the mobile phone. Also, because the IC card antenna projects from a rear surface of a chassis of the mobile phone, the distance between the IC card antenna and the LCD panel or the ear receiver can be extended by the amount by which the contactless IC card antenna projects from the rear surface of the chassis, and thus the thickness of the chassis of the mobile phone can be reduced.

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Patent Owner(s)

Patent OwnerAddress
SONY CORPORATIONTOKYO JAPAN

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Seita, Kazuhisa Kanagawa, JP 4 187

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