IC layouts with at least one layer that has more than one preferred interconnect direction, and method and apparatus for generating such a layout
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United States of America Patent
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Dec 6, 2005
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N/A
app pub date -
Aug 26, 2002
filing date -
Jan 22, 2002
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Abstract
Some embodiments of the invention provide a region of an integrated-circuit ('IC') layout that has a plurality of interconnect layers, where at least one particular layer has more than one preferred interconnect direction. In some of these embodiments, the region has several interconnect layers that have more than one preferred wiring direction each.
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