Method for manufacturing thin semiconductor chip
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United States of America Patent
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Dec 13, 2005
Grant Date -
Aug 11, 2005
app pub date -
Aug 28, 2003
filing date -
Sep 26, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
In manufacturing a thin semiconductor chip, a wafer is stably held during processing to maintain a stable shape and to avoid generation of cracks on the wafer. When a thin wafer having a surface thereon is to be processed, a rigid support body is adhered to the other surface of the thin wafer and a ring-shaped frame, encircling an outer periphery of the thin wafer, is adhered to the rigid support body.
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