US Patent No: 6,974,915
Number of patents in Portfolio can not be more than 2000
Printed wiring board interposer sub-assembly and method
Stats
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Dec 13, 2005
Issued date -
Nov 1, 2004
filing date -
10/979,366
serial no -
In Force
status
Importance
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Abstract
The details of a printed wiring board (PWB) sub-assembly and the method of producing the same are described. The sub-assembly comprises a printed circuit board electrically joined through a plurality of connections to one or more area array devices, such as modules or printed wiring boards. The sub-assembly can serve as a part of an original assembly. The sub-assembly can function as an after market item that can be readily substituted as a replacement for a failed component wherein the dimensional space between the printed circuit board and one or both of the area array devices must provide sufficient clearance for surface mounted devices.
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First Claim
Related Publications
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International Classification(s)
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Cited Art
| Patent Info | (Count) | # Cites | Year |
|---|---|---|---|
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| 5,282,312 Multi-layer circuit construction methods with customization features | 136 | 1991 | |
| 5,367,764 Method of making a multi-layer circuit assembly | 78 | 1991 | |
| 5,518,964 Microelectronic mounting with multiple lead deformation and bonding | 324 | 1994 | |
| 5,570,504 Multi-Layer circuit construction method and structure | 44 | 1995 | |
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| 5,476,211 Method of manufacturing electrical contacts, using a sacrificial member | 353 | 1993 | |
| 5,926,951 Method of stacking electronic components | 154 | 1996 | |
| 5,806,181 Contact carriers (tiles) for populating larger substrates with spring contacts | 253 | 1997 | |
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| 4,788,767 Method for mounting a flexible film semiconductor chip carrier on a circuitized substrate | 55 | 1987 | |
| 5,384,955 Method for replacing IC chip package interposer | 22 | 1994 | |
| 5,939,783 Electronic package | 39 | 1998 | |
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| 5,899,757 Compression connector | 16 | 1997 | |
| 6,036,502 Flexible circuit compression connector system and method of manufacture | 18 | 1999 | |
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| 4,988,306 Low-loss electrical interconnects | 44 | 1989 | |
| 5,720,630 Electrical connector | 20 | 1996 | |
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| 6,407,929 Electronic package having embedded capacitors and method of fabrication therefor | 83 | 2000 | |
| 6,840,777 Solderless electronics packaging | 5 | 2000 | |
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| 5,599,193 Resilient electrical interconnect | 49 | 1994 | |
| 6,271,482 Conductive elastomer interconnect | 18 | 1998 | |
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| 5,953,816 Process of making interposers for land grip arrays | 20 | 1997 | |
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| 5,883,788 Backing plate for LGA mounting of integrated circuits facilitates probing of the IC's pins | 11 | 1996 | |
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| 5,886,590 Microstrip to coax vertical launcher using fuzz button and solderless interconnects | 33 | 1997 | |
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| 5,969,953 Stacked memory for flight recorders | 21 | 1998 | |
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| 5,045,975 Three dimensionally interconnected module assembly | 40 | 1989 | |
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| 6,634,100 Interposer and methods for fabricating same | 50 | 2001 | |
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| 5,122,067 Umbilical release mechanism | 10 | 1991 | |
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| 5,014,419 Twisted wire jumper electrical interconnector and method of making | 20 | 1989 | |
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| 5,940,278 Backing plate for gate arrays or the like carries auxiliary components and provides probe access to electrical test points | 26 | 1997 | |
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| 5,833,471 Hold-down collar for attachment of IC substrates and elastomeric material to PCBS | 25 | 1996 | |
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| 6,074,219 Electromechanical subassembly including a carrier with springy contacts that exert large and small contact forces | 18 | 1998 | |
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| 5,624,268 Electrical connectors using anisotropic conductive films | 66 | 1996 | |
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| 5,650,919 Apparatus including a peak shaped dielectric dam | 13 | 1996 | |
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| 6,279,227 Method of forming a resilient contact structure | 27 | 1996 | |
| 6,019,610 Elastomeric connector | 17 | 1998 | |
Patent Citation Ranking
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Jun 13, 2013 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Jun 13, 2017 |
| Fee | Large entity fee | small entity fee | micro entity fee |
|---|---|---|---|
| Surcharge - 7.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
| Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
| Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
| Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |