Planarizing and testing of BGA packages
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United States of America Patent
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Dec 13, 2005
Grant Date -
Nov 4, 2004
app pub date -
Nov 19, 2003
filing date -
May 1, 2003
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The planarity of external terminals or a ball grid array on a device package can be improved through use of test probes that flatten the electrical terminals while forming the electrical contacts for package testing. After testing, the package has external terminals with improved planarity that improves the electrical connections formed during assembly of a system containing the package.
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