Reduced footprint tool for automated processing of microelectronic substrates
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United States of America Patent
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Dec 27, 2005
Grant Date -
May 15, 2003
app pub date -
Nov 12, 2002
filing date -
Nov 13, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention provides tools and methods of processing microelectronic substrates in which the tools maintain high throughput yet have dramatically lower footprint than conventional tools. In preferred aspects, the present invention provides novel tool designs in which multiple tool functions are overlapped in the x, y, and/or z axes of the tool in novel ways.
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