Importance

Loading Importance Indicators...

Abstract

In order to reduce micro scratches which tend to occur during chemical-mechanical polishing, a polishing slurry is diluted with deionized water immediately before it is supplied in a gap between a polishing pad and the surface of a wafer to be polished. By diluting the polishing slurry with deionized water to increase its volume, the concentration of coagulated particles contained in the polishing slurry can be lowered. For a mixture ratio of the polishing slurry and deionized water, about 1 (polishing slurry): 1-1.2 (deionized water) is used, and the concentration of silica contained in the diluted polishing slurry is adjusted to about 3-9 weight %, preferably about 4-8 weight %, and more preferably about 8 weight %.

Loading the Abstract Image...

First Claim