Laser system and method for material processing with ultra fast lasers
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United States of America Patent
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Dec 27, 2005
Issued Date -
N/A
app pub date -
Feb 26, 2004
filing date -
Mar 7, 2003
priority date (Note) -
Expired
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Abstract
Laser system and method for material processing with ultra fast lasers are provided. One aspect of the invention features the method which removes at least a portion of a target structure such as a memory link while avoiding undesirable damage to adjacent non-target structures. The method includes applying a single ultra short laser pulse to the target structure to remove the target structure with the single pulse.
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