Method for modulating shapes of substrates
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United States of America Patent
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Dec 27, 2005
Grant Date -
Jun 17, 2004
app pub date -
Dec 11, 2002
filing date -
Dec 11, 2002
priority date (Note) -
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Abstract
The present invention is directed to a method for modulating shapes of a substrate, having first and second opposed surfaces. This is achieved by creating a pressure differential between differing regions of the first opposed surface to attenuate structural distortions in the second opposed surface that results from external forces bearing on the substrate.
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