Polishing agent and lapping method
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United States of America Patent
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Jan 10, 2006
Grant Date -
Apr 29, 2004
app pub date -
Oct 20, 2003
filing date -
Oct 29, 2002
priority date (Note) -
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status (Latency Note)
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Abstract
Disclosed are a polishing agent containing at least globular-silica powder and alumina powder, as well as a lapping method in which a workpiece is held between an upper turn table and a lower turn table and is lapped by rotating the upper and the lower turn tables while being supplied with a polishing agent, wherein the polishing agent supplied is the polishing agent containing at least globular-silica powder and alumina powder. Thus, there can be provided a polishing agent capable of further improving the quality, especially, the flatness of workpieces such as silicon wafers and capable of polishing the workpieces at an excellent polishing rate.
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