Bond enhancement for thermally insulated ceramic matrix composite materials
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United States of America Patent
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Jan 10, 2006
Grant Date -
Feb 3, 2005
app pub date -
Jul 31, 2003
filing date -
Jul 31, 2003
priority date (Note) -
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status (Latency Note)
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Abstract
A composite structure (62) having a bond enhancement member (76) extending across a bond joint (86) between a ceramic matrix composite (CMC) material (80) and a ceramic insulation material (82), and a method of fabricating such a structure. The bond enhancement member may extend completely through the CMC material to be partially embedded in a core material (84) bonded to the CMC material on an opposed side from the insulation material. A mold (26) formed of a fugitive material having particles (18) of a bond enhancement material may be used to form the CMC material. A two-piece mold (38, 46) may be used to drive a bond enhancement member partially into the CMC material. A compressible material (56) containing the bond enhancement member may be compressed between a hard tool (60) and the CMC material to drive a bond enhancement member partially into the CMC material. A surface (98) of a ceramic insulation material (92) having a bond enhancement member (96) extending therefrom may be used as a mold for laying up a CMC material.
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