Dielectric mold for uniform heating and molding of polymers and composites in microwave ovens
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 10, 2006
Grant Date -
N/A
app pub date -
May 29, 2002
filing date -
May 29, 2002
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A mold for uniformly heating working material to form a workpiece using a microwave oven. Uniform heating of a workpiece of variable thickness may be obtainied in a microwave oven with a uniform electric field in its cavity if the mold material is selected to have a dielectric constant and a thermosensitivity equal to that of the working material. The thermosensitivity of a material is its dissipation factor divided by the product of its density and specific heat. Uniform heating of a uniformly thick workpiece can be obtained in a conventional microwave by selecting the mold material to have a relative thermosensitivity equal to that of the working material. The relative thermosensitivity of a material is its dissipation factor divided by the product of its dielectric constant, density, and specific heat.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully