Wafer probing that conditions devices for flip-chip bonding
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United States of America Patent
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Jan 10, 2006
Grant Date -
Nov 4, 2004
app pub date -
May 1, 2003
filing date -
May 1, 2003
priority date (Note) -
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status (Latency Note)
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Abstract
A probing system or process for electrical testing of a device fabricated on a wafer also conditions terminals such as solder balls on the device to improve uniformity of the heights of the terminals and improve the reliability of connections to an interconnect substrate in a flip-chip package or to a printed circuit board in a chip-on-board application. The system can employ a probe card that is a printed circuit board and/or is substantially identical to interconnect substrates used in flip-chip packaging. The probe card can be replaceable on a test head to allow for quick changes the reduce ATE downtime and to accommodate device changes such as a die shrink. Probe tips on the probe card can be the contact pads or bumps that are the normal electrical contact structures of the interconnect substrates.
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