Thermal control of a DUT using a thermal control substrate
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United States of America Patent
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Jan 10, 2006
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N/A
app pub date -
Jul 28, 2004
filing date -
Jul 19, 2002
priority date (Note) -
Expired
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Abstract
A solid state thermal control device contains a substrate and a plurality of solid state thermal elements on the substrate. The thermal elements are adapted to provide thermal control to a device under test (DUT). Each solid state thermal element contains at least one solid state heater and an active control circuit adapted to control a thermal output of the heater. Optionally, the each thermal element may also include a solid state temperature sensor.
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