Methods and apparatus for particle reduction in MEMS devices
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United States of America Patent
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Jan 17, 2006
Grant Date -
Nov 11, 2004
app pub date -
May 7, 2003
filing date -
May 7, 2003
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method for assembling a micro-electromechanical system (MEMS) device that includes a micro-machine is described. The method comprises forming the micro-machine on a die, the die having a top surface and a bottom surface, providing a plurality of die bonding pedestals on a surface of a housing, and mounting at least one of the top surface of the die and components of the micro-machine to the die bonding pedestals such that a bottom surface of the die at least partially shields components of the micro-machine from loose gettering material.
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