Component assembly with solder glass preform for lighting device and sealing process
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United States of America Patent
Stats
-
Jan 17, 2006
Grant Date -
May 6, 2004
app pub date -
Oct 31, 2002
filing date -
Oct 31, 2002
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Disclosed are a component assembly for an electrical lighting device and method for sealing the same. The assembly comprises the component, such as an electrode lead wire, and a solder glass perform. The component assembly is useful, for example, in hermetically sealing and affixing lamp components, such as electrical lead wires and exhaust tubulation, to a low-pressure fluorescent discharge lamp envelope having phosphor coating already applied thereto without causing damage to other lamp components sensitive to high temperature. The present invention is particularly suitable for lamp envelope made of borosilicate glass having a CTE from 0 to 300° C. in the range of 30-45×10-7° C.-1.
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Cited Art Landscape
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