Temperature compensation for silicon MEMS resonator
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 17, 2006
Grant Date -
Oct 21, 2004
app pub date -
Apr 16, 2003
filing date -
Apr 16, 2003
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Thermally induced frequency variations in a micromechanical resonator are actively or passively mitigated by application of a compensating stiffness, or a compressive/tensile strain. Various composition materials may be selected according to their thermal expansion coefficient and used to form resonator components on a substrate. When exposed to temperature variations, the relative expansion of these composition materials creates a compensating stiffness, or a compressive/tensile strain.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully