Electronic assembly, and apparatus and method for the assembly thereof
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United States of America Patent
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Jan 24, 2006
Grant Date -
Oct 20, 2005
app pub date -
Apr 19, 2004
filing date -
Apr 19, 2004
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An electronic assembly having a first layer and a second layer is disclosed. The first layer has a first interface surface and a plurality of cavities formed in the first interface surface. The second layer has a second interface surface and a plurality of projections disposed at the second interface surface, where the plurality of projections are aligned with and disposed at the plurality of cavities. An electrically conductive connecting material is disposed at the plurality of cavities such that the connecting material connects the plurality of projections to the respective plurality of cavities.
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